EXPERIENCE MAXIMUM QUALITY

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2 EXPERIENCE MAXIMUM QUALITY Qulamax is dedicated to the success of our customers by being a world-class provider of innovative test product solutions to the semiconductor and mobile device industry. Qualmax, first established in 1986, offers a wide spectrum of solutions and services designed to meet the unique challenges of each customer. As a leading provider of test product solutions, we at Qualmax are committed to delivering value added solutions through our product offerings and expert customer support. Qualmax application and design engineering occurs in the United States and Korea by our engineers each of whom has extensive knowledge and hands-on expertise in semiconductor test applications. Each new technology node brings additional requirements and challenges which drive the need for advanced test product solutions. Qualmax strives to consistently deliver advanced capabilities with cost-effective production performance. We intrinsically understand that to preserve customer trust we must continually deliver new solutions on time. This level of understanding and execution creates a dynamic synergy which often leads to new potentials and greater opportunities for both parties. Qualmax s goal is to manufacture and deliver your test solutions with the highest level of quality. Qualmax spring contact probes are manufactured and validated in-house at our state-of-the-art manufacturing facility and test lab, which is ISO certified, maintaining the highest standard of quality and your guaranteed satisfaction. Currently Headquartered in Pyeongtaek City, Korea, Qualmax has offices in San Jose, California, Hsinchu, Taiwan, Singapore and Laguna, Philippines plus extensive sales coverage with professional sales representatives located throughout the world. Qualmax s global support organization provides the ability to support multinational accounts seamlessly. 2

3 Design Excellence Manufacturing Excellence Qualmax provides advanced designs for Semiconductor Test Socket, Spring Contact Probes, Custom Test Interfaces and Wafer Level Package (WLP) solutions. Cutting edge design engineering is assured by our dedicated team which has extensive hands-on experience and knowledge with the most complex and challenging applications. Test yield and cost are the key factors we consider with every design. We have over 3,000 probe designs in our data base already, from which you can choose anyone immediately. Otherwise, we can design a new probe within 24 hours for your approval without NRE charge. Our Application Engineering team works hand in hand with your engineers to develop the optimum solution for your specific test needs. Our primary goal is to provide cuttingedge solutions which meet and exceed the needs of our clients. Qualmax s goal is to manufacture and deliver your test solutions on time and with zero defects. To support the expanding demand for our solutions we have opened a manufacturing and test lab in Pyeongtaek City, Korea. In this state-of-the-art facility, we do every phase of manufacturing - design, piece parts fabrication, heat treatment, plating, assembly and quality control - all in-house. Regardless of the unique dynamic associated with each customers operation we can deliver our solutions during steady state high volume periods and also address and rapidly respond to burst capacity requirements. Our manufacturing process is designed to ensure the timely delivery of new soltions. This in turn helps support your ability to secure design wins and time to market advantages. Our unique manufacturing approach ensures you will consistently receive the highest value available regardless of the complexity of your application. Service Excellence Product Excellence Qualmax offers highly demanded test product solutions to meet the needs of the dynamic markets and customers we support. To maximize value, we offer a customizable portfolio of solutions and services spanning virtually every aspect of the assembly and test arena. Our service starts with a dialog, with each customer, to ensure the complete understanding of objectives, goals and constraints for every opportunity. The output of which is a custom solution structured to precisely address both the technical and commercial requirements of your test applications. Qualmax understands the value of global support and the benefits of close proximity to the locations where your products are designed, manufactured and ultimately tested. Our offices located throughout North America and Asia is testament of our commitment to provide a global support organization. Continuing investments are made to our support network to ensure we maintain fast and effective support at your critical locations. Qualmax is an advanced test hardware solution company solely focused on providing semiconductor companies and mobile device manufactures the solutions to today s most challenging test applications. Qualmax offers a wide array of products that support the test hardware needs of almost any device. Utilizing our brand new factory in Korea, Qualmax manufactures high performance spring contact probes to 0.2mm pitch, Kelvin contacts, test probes with extremely short signal path, high current probes and high temperature probes to allow for a full turnkey test solution. 3

4 相生 signifies the importance of the business eco system of today, which involves customers, employees, vendors, even competitors as well as the society with which all of us are members and all are deserving of a good life Dear customers, Sangseng, a Korean word which literally means mutual life, is the motto with which every employee at Qualmax integrates into every aspect of our daily routines. It is derived from an old oriental philosophy, and can be translated into win-win in contemporary English. Sangseng is, however, multi-faceted and unlike the original military use of the term win-win, which involved two combatants locked in a goal of defeating or destroying the other party, Sanseng is for life. It can more appropriately be translated as coexistence in modern English. So, Sangseng signifies the importance of the business eco system of today, which involves customers, employees, vendors, even competitors as well as the society with which all of us are members and all are deserving of a good life. With this core value in mind, Qualmax had opened a brand new factory in Korea in 2011 to manufacture spring contact probes and test sockets. We have a world class manufacturing facility and know-how to produce quality products effectively, irrespective of the batch size. Qualmax was the first to introduce two weeks lead time in the semiconductor test industry back in 2004, and now with our own manufacturing we are elevating our market leadership again to bring forth mutual life Sangseng for everyone involved in our business. Experience Maximum Quality with Qualmax. I thank you for your support and patronage, and look forward to seeing you soon. With best regards, Jong Choi / President & CEO 4

5 Quality Assurance From design completion, through manufacturing, to outgoing inspection, an array of characteristics are reviewed and scrutinized for every probe built. At design completion state-of-the-art verification tools are deployed to ensure every piece part is complant with mechanical and electrical standards. Manufacturing and assembly occurs in a clean room where critical parameters like: dimensional accuracy, hardness, and plating thickness are measured and validated to conform to design tolerances. A rigorous characterization is performed on all new designs to ensure reliability specifications and design criteria are achieved. To accomplish this goal a battery of performance variables are assessed including: life span cycling, force vs. deflection, force vs. contact resistance and an analysis of S-parameters utilizing a vector network analyzer. Detailed measurement reports are provided to the customers including: bandwidth, current carrying capacity, inductance, and capacitance. Outgoing inspection involves 100% X-ray screening, physical cycling of the probes to check for assembly issues and visual inspection to screen for cosmetic defects. All procedures are ISO 9001 certified. With Qualmax Maximum Quality is guaranteed. Insertion loss (S21) for Sample A vs. Sample B Contact Resistance vs. Displacement CRes Average << 40mohms; CRes +2 Std Dev << 50mohms Force vs. Displacement Force vs. Current carrying capacity EDS Quantitative Results Element Wt% At% PK Au M Ni K Cu K

6 PRODUCT VARIATION Modification or Customization Available 9p - 14p Pitch 0.40(0.016) 0.40(0.016) 0.40(0.016) 0.40(0.016) 0.50(0.020) 0.50(0.020) 0.50(0.020) 0.65(0.026) 0.65(0.026) 0.80(0.031) 0.80(0.031) 1.00(0.039) Total Length 5.52(0.217) 5.70(0.224) 2.55(0.100) 5.70(0.224) 2.00(0.079) 3.20(0.126) 5.70(0.224) 3.70(0.146) 6.43(0.253) 3.20(0.126) 4.80(0.189) 4.30(0.169) Barrel Dia 0.26(0.010) 0.26(0.010) 0.31(0.012) 0.31(0.012) 0.35(0.014) 0.38(0.015) 0.38(0.015) 0.51(0.020) 0.53(0.021) 0.57(0.022) 0.57(0.022) 0.84(0.033) Page No

7 15-19p 19p - 20p (0.016) 0.40(0.016) 0.40(0.016) 0.65(0.026) 0.80(0.031) 0.80(0.031) 0.80(0.031) 0.80(0.031) 1.00(0.039) 0.80(0.031) 0.20(0.008) 0.15(0.006) 3.25(0.13) 3.80(0.150) 5.64(0.222) 5.70(0.224) 5.70(0.224) 2.65(0.104) 3.55(0.140) 4.84(0.191) 4.46(0.176) 1.00(0.039) 5.95(0.234) 5.00(0.197) 0.31(0.012) 0.31(0.012) 0.31(0.012) 0.50(0.020) 0.58(0.023) 0.60(0.024) 0.62(0.024) 0.70(0.028) 0.80(0.031) 0.60(0.024) 0.13(0.005) 0.11(0.004) Four piece probe Three piece probe Special probe All dimensions are in mm (inches) 7

8 TIP STYLE GUIDE Conical (Convex) Concave Chisel (Pyramid) Concave Chisel Flat Chisel Spear Flat Spear Point (Star) Spherical Radius 3 Point (Reduced Crown) Spherical Radius 4 Point Crown Point (Spear Point) 4 Point Crown Point Tulip Flex Tip Serrated 8

9 Ø 0.17 (0.0067) 0.92 (0.0362) Ø 0.10 (0.0039) 1.10 (0.0433) Ø 0.26 (0.0102) 4.00 (0.1575) 5.52 (0.2173) Ø 0.26 (0.0102) 4.00 (0.1575) 5.70 (0.2244) Ø 0.12 (0.0047) 0.60 (0.0236) Ø 0.10 (0.0039) 0.60 (0.0236) Device Pitch : 0.40mm (0.016) Signal Path Length : 5.00mm (0.197) Spring Force : 10.5gf (0.370oz) at 0.52mm Recommended Travel Device Pitch : 0.40mm (0.016) Signal Path Length : 5.05mm (0.199) Spring Force : 13.5gf (0.476oz) at 0.65mm Recommended Travel Spring : Stainless steel, Gold plated Device Side : Hardened steel, Gold plated Board Side : Hardened steel, Gold plated Current Carrying Capacity : 2 amps continuous Loop Inductance : 0.91nH Signal Pin to Return Capacitance : 0.36pF -1 db Insertion Loss Bandwidth : 6.17GHz Current Carrying Capacity : 2 amps continuous Loop Inductance : 1.15nH Signal Pin to Return Capacitance : 0.46pF -1 db Insertion Loss Bandwidth : 5.05GHz All specifications are subject to change without notice All specifications may be modified upon customer request All dimensions are in mm (inches) All spring forces are in grams (ounces) 9

10 Ø 0.15 (0.0059) 1.10 (0.0433) Ø 0.16 (0.0063) 0.65 (0.0256) Ø 0.31 (0.0122) 1.60 (0.0630) 2.55 (0.1004) Ø 0.31 (0.0122) 4.00 (0.1575) 5.70 (0.2244) Ø 0.16 (0.0063) 0.30 (0.0118) Ø 0.15 (0.0059) 0.60 (0.0236) Device Pitch : 0.40mm (0.016) Signal Path Length : 2.10mm (0.083) Spring Force : 18gf (0.635oz) at 0.45mm Recommended Travel Device Pitch : 0.40mm (0.016) Signal Path Length : 5.20mm (0.205) Spring Force : 20.3gf (0.716oz) at 0.50mm Recommended Travel Current Carrying Capacity : 2 amps continuous Loop Inductance : 0.49nH Signal Pin to Return Capacitance : 0.20pF -1 db Insertion Loss Bandwidth : 29.67GHz Current Carrying Capacity : 2 amps continuous Loop Inductance : 1.20nH Signal Pin to Return Capacitance : 0.48pF -1 db Insertion Loss Bandwidth : 4.42GHz All specifications are subject to change without notice All specifications may be modified upon customer request All dimensions are in mm (inches) 10

11 Ø 0.18 (0.0071) 0.50 (0.0197) Ø 0.20 (0.0079) 0.50 (0.0197) Ø 0.35 (0.0138) 1.20 (0.0472) 2.00 (0.0787) Ø 0.38 (0.0150) 2.30 (0.0906) 3.20 (0.1260) Ø 0.20 (0.0079) 0.30 (0.0118) Ø 0.18 (0.0071) 0.40 (0.0157) Device Pitch : 0.50mm (0.020) Signal Path Length : 1.70mm (0.067) Spring Force : 18.5gf (0.653oz) at 0.30mm Recommended Travel Device Pitch : 0.50mm (0.020) Signal Path Length : 2.75mm (0.108) Spring Force : 16gf (0.564oz) at 0.45mm Recommended Travel Current Carrying Capacity : 2 amps continuous Loop Inductance : 0.43nH Signal Pin to Return Capacitance : 0.17pF -1 db Insertion Loss Bandwidth : 34.30GHz Current Carrying Capacity : 2 amps continuous Loop Inductance : 0.75nH Signal Pin to Return Capacitance : 0.30pF -1 db Insertion Loss Bandwidth : 19.27GHz All spring forces are in grams (ounces) Some models may be proprietary and not be available for general distribution 11

12 Ø 0.20 (0.0079) 1.65 (0.0650) Ø 0.30 (0.0118) 0.80 (0.0315) Ø 0.38 (0.0150) 3.40 (0.1339) 5.70 (0.2244) Ø 0.51 (0.0201) 2.40 (0.0945) 3.70 (0.1457) Ø 0.30 (0.0118) 0.50 (0.0197) Ø 0.20 (0.0079) 0.65 (0.0256) Device Pitch : 0.50mm (0.020) Signal Path Length : 4.95mm (0.195) Spring Force : 30gf (1.058oz) at 0.75mm Recommended Travel Device Pitch : 0.65mm (0.026) Signal Path Length : 3.00mm (0.118) Spring Force : 23.5gf (0.829oz) at 0.70mm Recommended Travel Current Carrying Capacity : 2 amps continuous Loop Inductance : 0.82nH Signal Pin to Return Capacitance : 0.33pF -1 db Insertion Loss Bandwidth : 14.84GHz Current Carrying Capacity : 3 amps continuous Loop Inductance : 0.63nH Signal Pin to Return Capacitance : 0.25pF -1 db Insertion Loss Bandwidth : 21.17GHz All specifications are subject to change without notice All specifications may be modified upon customer request All dimensions are in mm (inches) 12

13 (0.0673) Ø 0.25 (0.0098) Ø 0.34 (0.0134) 0.60 (0.0236) Ø 0.53 (0.0209) 3.72 (0.1465) 6.43 (0.2531) Ø 0.57 (0.0224) 2.00 (0.0787) 3.20 (0.1260) Ø 0.34 (0.0134) 0.60 (0.0236) Ø 0.25 (0.0098) 1.00 (0.0394) Device Pitch : 0.65mm (0.026) Signal Path Length : 5.46mm (0.215) Spring Force : 26gf (0.917oz) at 0.97mm Recommended Travel Device Pitch : 0.80mm (0.031) Signal Path Length : 2.70mm (0.106) Spring Force : 25gf (0.882oz) at 0.50mm Recommended Travel Spring : Stainless steel, Gold plated Device Side : Hardened steel, Gold plated Current Carrying Capacity : 3 amps continuous Loop Inductance : 0.79nH Signal Pin to Return Capacitance : 0.32pF -1 db Insertion Loss Bandwidth : 15.98GHz Current Carrying Capacity : 3 amps continuous Loop Inductance : 0.58nH Signal Pin to Return Capacitance : 0.23pF -1 db Insertion Loss Bandwidth : 27.00GHz All spring forces are in grams (ounces) Some models may be proprietary and not be available for general distribution 13

14 Ø 0.35 (0.0138) 1.08 (0.0425) Ø 0.46 (0.0181) 1.00 (0.0394) Ø 0.57 (0.0224) 3.20 (0.1260) 4.80 (0.1890) Ø 0.84 (0.0331) 2.80 (0.1102) 4.30 (0.1693) Ø 0.35 (0.0138) 0.52 (0.0205) Ø 0.46 (0.0181) 0.50 (0.0197) Device Pitch : 0.80mm (0.031) Signal Path Length : 4.20mm (0.165) Spring Force : 29.3gf (1.034oz) at 0.60mm Recommended Travel Device Pitch : 1.00mm (0.039) Signal Path Length : 3.45mm (0.136) Spring Force : 25gf (0.882oz) at 0.85mm Recommended Travel Spring : Stainless steel, Gold plated Barrel : Brass, Gold plated Spring : Stainless steel, Gold plated Device Side : Hardened steel, Gold plated Current Carrying Capacity : 3 amps continuous Loop Inductance : 0.90nH Signal Pin to Return Capacitance : 0.36pF -1 db Insertion Loss Bandwidth : 8.05GHz Current Carrying Capacity : 5 amps continuous Loop Inductance : 0.69nH Signal Pin to Return Capacitance : 0.28pF -1 db Insertion Loss Bandwidth : 19.61GHz All specifications are subject to change without notice All specifications may be modified upon customer request All dimensions are in mm (inches) 14

15 Ø 0.15 (0.0059) 0.50 (0.0197) Ø 0.18 (0.01) 0.95 (0.03) Ø 0.31 (0.01) 1.80 (0.05) 3.25 (0.13) Ø 0.31 (0.0122) 2.60 (0.1024) 3.80 (0.1496) Ø 0.16 (0.01) 0.5 (0.05) Ø 0.15 (0.0059) 0.70 (0.0276) Device Pitch : 0.40mm(0.016) Signal Path Length : 3.25mm(0.128) Spring Force : 25gf (0.882oz) at 0.35mm Recommended Travel Device Pitch : 0.40mm (0.016) Signal Path Length : 3.30mm (0.130) Spring Force : 25gf (0.882 oz) at 0.50mm Recommended Travel Barrel : Phosphor Bronze, Gold Plated Device Side : Pd Alloy Board Side : Hardened Beryllium Copper, Gold Plated Device Side : Hardened steel, Gold plated Current Carrying Capacity : 3 amps continuous Loop Inductance : 0.46nH Signal Pin to Return Capacitance : 0.18pF -1 db Insertion Loss Bandwidth : 31.16GHz Current Carrying Capacity : 2 amps continuous Loop Inductance : 0.63nH Signal Pin to Return Capacitance : 0.25pF -1 db Insertion Loss Bandwidth : 22.17GHz All spring forces are in grams (ounces) Some models may be proprietary and not be available for general distribution 15

16 Ø 0.20 (0.0079) 0.87 (0.0343) Ø 0.26 (0.0102) 1.00 (0.0394) Ø 0.31 (0.0122) 3.90 (0.1535) 5.64 (0.2220) Ø 0.50 (0.0197) 3.60 (0.1417) 5.70 (0.2244) Ø 0.26 (0.0102) 1.10 (0.0433) Ø 0.15 (0.0059) 0.87 (0.0343) Device Pitch : 0.40mm (0.016) Signal Path Length : 5.04mm (0.198) Spring Force : 22.1gf (0.780oz) at 0.60mm Recommended Travel Device Pitch : 0.65mm (0.026) Signal Path Length : 4.94mm (0.194) Spring Force : 20.1gf (0.709oz) at 0.76mm Recommended Travel Spring : Stainless steel, Gold plated Spring : Stainless steel, Gold plated Current Carrying Capacity : 2 amps continuous Loop Inductance : 0.89nH Signal Pin to Return Capacitance : 0.36pF -1 db Insertion Loss Bandwidth : 10.55GHz Current Carrying Capacity : 3 amps continuous Loop Inductance : 0.84nH Signal Pin to Return Capacitance : 0.34pF -1 db Insertion Loss Bandwidth : 13.70GHz All specifications are subject to change without notice All specifications may be modified upon customer request All dimensions are in mm (inches) 16

17 Ø 0.30 (0.0118) 1.00 (0.0394) Ø 0.50 (0.0197) 1.90 (0.0748) 2.65 (0.1043) Ø 0.58 (0.0228) 3.60 (0.1417) 5.70 (0.2244) Ø 0.25 (0.0098) 0.75 (0.0295) Ø 0.30 (0.0118) 1.10 (0.0433) Device Pitch : 0.80mm (0.031) Signal Path Length : 4.94mm (0.194) Spring Force : 26.7gf (0.942oz) at 0.76mm Recommended Travel Device Pitch : 0.80mm (0.031) Signal Path Length : 2.15mm (0.085) Spring Force : 27.5gf (0.970oz) at 0.50mm Recommended Travel Spring : Stainless steel, Gold plated Device Side : Hardened steel, Gold plated Current Carrying Capacity : 3 amps continuous Loop Inductance : 0.84nH Signal Pin to Return Capacitance : 0.34pF -1 db Insertion Loss Bandwidth : 12.30GHz Current Carrying Capacity : 3 amps continuous Loop Inductance : 0.46nH Signal Pin to Return Capacitance : 0.18pF -1 db Insertion Loss Bandwidth : 31.16GHz All spring forces are in grams (ounces) Some models may be proprietary and not be available for general distribution 17

18 Ø 0.52 (0.0205) 2.80 (0.1102) 3.55 (0.1398) Ø 0.60 (0.0236) 3.53 (0.1390) 4.84 (0.1906) Ø 0.30 (0.0118) 0.75 (0.0295) Ø 0.30 (0.0118) 1.31 (0.0516) Device Pitch : 0.80mm (0.031) Signal Path Length : 2.95mm (0.116) Spring Force : 25gf (0.882oz) at 0.60mm Recommended Travel Device Pitch : 0.80mm (0.031) Signal Path Length : 4.04mm (0.159) Spring Force : 33.4gf (1.178oz) at 0.80mm Recommended Travel Spring : Stainless steel, Gold plated Current Carrying Capacity : 3 amps continuous Loop Inductance : 0.62nH Signal Pin to Return Capacitance : 0.25pF -1 db Insertion Loss Bandwidth : 26.80GHz Current Carrying Capacity : 4 amps continuous Loop Inductance : 0.76nH Signal Pin to Return Capacitance : 0.30pF -1 db Insertion Loss Bandwidth : 18.82GHz All specifications are subject to change without notice All specifications may be modified upon customer request All dimensions are in mm (inches) 18

19 Ø 0.67 (0.0264) 3.55 (0.1398) 4.46 (0.1756) Ø 0.50 (0.0197) 0.70 (0.0276) 1.00 (0.0394) Ø 0.30 (0.0118) 0.30 (0.0118) Ø 0.35 (0.0138) 0.91 (0.0358) Device Pitch : 1.00mm (0.039) Signal Path Length : 3.81mm (0.150) Spring Force : 40.1gf (1.414 oz) at 0.65mm Recommended Travel Device Pitch : 0.80mm (0.031) Signal Path Length : 0.80mm (0.031) Spring Force : 14gf (0.494 oz) at 0.20mm Recommended Travel Barrel : Brass, Gold plated Device Side : Phosphor Bronze, Gold plated Current Carrying Capacity : 5 amps continuous Loop Inductance : 0.76nH Signal Pin to Return Capacitance : 0.30pF -1 db Insertion Loss Bandwidth : 18.86GHz Current Carrying Capacity : 3 amps continuous Loop Inductance : 0.27nH Signal Pin to Return Capacitance : 0.11pF -1 db Insertion Loss Bandwidth : 40.10GHz All spring forces are in grams (ounces) Some models may be proprietary and not be available for general distribution 19

20 Ø 0.10 (0.005) 1.50 (0.005) Ø 0.06 (0.0024) 0.50 (0.0197) Ø (0.15) Ø 0.11 (0.0043) 3.90 (0.1535) 5.00 (0.1969) Ø 0.13 (0.005) 4.15 (0.053) Ø 0.12 (0.005) 0.30 (0.05) Ø 0.08 (0.0031) 0.60 (0.0236) Device Pitch : 0.20mm(0.008) Signal Path Length : 5.95mm(0.234) Spring Force : 10gf (0.353oz) at 0.45mm Recommended Travel Device Pitch : 0.15mm(0.006) Signal Path Length : 4.60mm(0.181) Spring Force : 6gf (0.212oz) at 0.40mm Recommended Travel Barrel : Phosphor Bronze, Gold Plated Device Side : Pd Alloy Board Side : Hardened Steel, Gold Plated Barrel : Phosphor Bronze, Gold Plated Device Side : Pd Alloy Board Side : Pd Alloy Typical Resistance : <300mΩ Current Carrying Capacity : 0.3 amps continuous Loop Inductance : 1.38nH Signal Pin to Return Capacitance : 0.55pF -1 db Insertion Loss Bandwidth : 6.5GHz Typical Resistance : < 300mΩ Current Carrying Capacity : 0.3 amps continuous Loop Inductance : 1.15nH Signal Pin to Return Capacitance : 0.46pF -1 db Insertion Loss Bandwidth : 8.5GHz All specifications are subject to change without notice All specifications may be modified upon customer request All dimensions are in mm (inches) 20

21 / (0.05) (0.10) (0.05) 3~5 Bending Spec Spring Force : 25gf at 1.00mm Recommended Travel Current Carrying Capacity : 0.5 amps continuius Typical Resistance : <50mΩ Plunger : Hardended Steel, Gold Plated Barrel : Phosphor Bronze, Gold Plated Spring : Music Wire or Stainless Wire, Gold Plated Ø 0.15 (0.01) Ø 0.25 (0.01) (0.05) (0.05) Ø Ø 0.35 (0.01) Wire / (0.10) 1.50 (0.05) (0.05) Spec Spring Force : 30gf at 1.00mm Recommended Travel Current Carrying Capacity : 0.5 amps continuius Typical Resistance : <50mΩ Plunger : Hardended Steel, Gold Plated Barrel : Phosphor Bronze, Gold Plated Spring : Music Wire or Stainless Wire, Gold Plated Ø 0.22 (0.01) Ø 0.30 (0.01) (0.05) 9.00 Ø Ø 0.40 (0.01) Wire / (0.10) 1.50 (0.05) (0.05) Spec Spring Force : 40gf at 1.00mm Recommended Travel Current Carrying Capacity : 1 amps continuius Typical Resistance : <50mΩ Plunger : Hardended Steel, Gold Plated Barrel : Phosphor Bronze, Gold Plated Spring : Music Wire or Stainless Wire, Gold Plated Ø 0.25 (0.01) Ø 0.35 (0.01) (0.05) (0.05) Ø Ø 0.45 (0.01) Wire All spring forces are in grams (ounces) Some models may be proprietary and not be available for general distribution 21

22 / (0.10) 1.50 (0.05) (0.05) Spec Spring Force : 40gf at 1.00mm Recommended Travel Current Carrying Capacity : 2 amps continuius Typical Resistance : <50mΩ Plunger : Hardended Steel, Gold Plated Barrel : Phosphor Bronze, Gold Plated Spring : Music Wire or Stainless Wire, Gold Plated Ø 0.26 (0.01) Ø 0.40 (0.01) (0.05) Ø Ø 0.56 (0.01) Ø 0.49 (0.01) Wire / (0.10) 2.80 (0.05) (0.05) Spec. Ø 0.37 (0.01) Ø 0.50 (0.01) Spring Force : 45gf at 1.80mm Recommended Travel Current Carrying Capacity : 2 amps continuius Typical Resistance : <50mΩ Plunger : Hardended Steel, Gold Plated Barrel : Phosphor Bronze, Gold Plated Spring : Music Wire or Stainless Wire, Gold Plated Ø 0.76 (0.01) (0.05) Ø 0.68 (0.01) Ø 0.56 (0.01) Wire / (0.10) 3.65 (0.05) (0.05) Spec. Ø 0.52 (0.01) Ø 0.68 (0.01) Spring Force : 65gf at 1.80mm Recommended Travel Current Carrying Capacity : 2 amps continuius Typical Resistance : <50mΩ Plunger : Hardended Steel, Gold Plated Barrel : Phosphor Bronze, Gold Plated Spring : Music Wire or Stainless Wire, Gold Plated Ø 0.95 (0.01) (0.05) Ø 087 (0.01) Ø 0.76 (0.01) Wire All specifications are subject to change without notice All specifications may be modified upon customer request All dimensions are in mm (inches) 22

23 / (0.10) 8.10 (0.05) (0.05) Ø 0.48 (0.01) Ø 0.68 (0.01) (0.05) Wire Ø 0.98 (0.01) Ø 0.87 (0.01) Ø 0.76 (0.01) Spec. Spring Force : 40gf at 1.00mm Recommended Travel Current Carrying Capacity : 2 amps continuius Typical Resistance : <50mΩ Plunger : Hardended Steel, Gold Plated Barrel : Phosphor Bronze, Gold Plated Spring : Music Wire or Stainless Wire, Gold Plated / (0.10) 8.10 (0.05) (0.05) Ø 0.75 (0.01) Ø 1.01 (0.01) (0.08) (0.01) 9.05 (0.01) Ø 1.40 (0.01) Ø 1.28 (0.01) Ø 1.00 (0.01) Ø 0.55 (0.01) Spec. Spring Force : 40gf at 1.00mm Recommended Travel Current Carrying Capacity : 2 amps continuius Typical Resistance : <50mΩ Plunger : Hardended Steel, Gold Plated Barrel : Phosphor Bronze, Gold Plated Spring : Music Wire or Stainless Wire, Gold Plated All spring forces are in grams (ounces) Some models may be proprietary and not be available for general distribution 23

24 Qualmax, Inc N. 1 st St., Suite 340, San Jose, CA 95134, USA TEL: FAX: Qualmax Testech, Inc. 477 Hyeondeukseo-ro, Hyeondeuk-myun, Pyeongtaek-si, Gyunggi-do, Korea TEL: FAX: info@qualmax.com 24