B (bottom) Package type descriptive code. LFBGA624 Package type industry code. LFBGA624 Package style descriptive code

Transcription

1 LFBGA624, plastic, low profile finepitch ball grid array; 624 bumps; 0.8 pitch; 21 x 21 x 1.6 body 24 January Package information Package suary Terminal position code B (bottom) Package type descriptive code LFBGA624 Package type industry code LFBGA624 Package style descriptive code LFBGA (low profile finepitch ball grid array) Package body material type P (plastic) Mounting method type S (surface mount) Issue date Manufacturer package code 98ASA00404D Table 1. Package suary Parameter Min Nom Max Unit package length 21 package width 21 seated height 1.6 nominal pitch 0.8 actual quantity of termination 624

2 LFBGA624, plastic, low profile finepitch ball grid array; 624 bumps; 0.8 pitch; 21 x 21 x 1.6 body 2 Package outline Figure 1. Package outline LFBGA624 () All information provided in this document is subject to legal disclaimers. NXP B.V All rights reserved. 2 / 5

3 LFBGA624, plastic, low profile finepitch ball grid array; 624 bumps; 0.8 pitch; 21 x 21 x 1.6 body Figure 2. Package outline note LFBGA624 () All information provided in this document is subject to legal disclaimers. NXP B.V All rights reserved. 3 / 5

4 LFBGA624, plastic, low profile finepitch ball grid array; 624 bumps; 0.8 pitch; 21 x 21 x 1.6 body 3 Legal information Disclaimers Limited warranty and liability Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. takes no responsibility for the content in this document if provided by an information source outside of. In no event shall be liable for any indirect, incidental, punitive, special or consequential damages (including without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of coercial sale of. Right to make changes reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. All information provided in this document is subject to legal disclaimers. NXP B.V All rights reserved. 4 / 5

5 LFBGA624, plastic, low profile finepitch ball grid array; 624 bumps; 0.8 pitch; 21 x 21 x 1.6 body Contents 1 Package suary Package outline Legal information...4 NXP B.V All rights reserved. For more information, please visit: For sales office addresses, please send an to: salesaddresses@nxp.com Date of release: 24 January 2019